RAMXEED’s analog circuit technologies for RF communication and AD adopted by SEED's smart contact lenses innovation!
Overview
RAMXEED has developed two types of functional chips, an RFID function for wireless communication and an AD converter function that can connect various sensors, on a LSI chip with FeRAM measuring only 1.04 mm□, and has started providing them as "ASSP chipset".
It has been adopted as a common architecture for a platform that accelerates the development and manufacturing of smart contact lenses (Figure 1) and can be used to collect and process various data depending on the types of sensors that are combined.
Details
SEED, a company specializing in production and sales of contact lenses, released an advanced multipurpose platform for accelerating the development and manufacturing of smart contact lenses. This platform is built with components including control LSI, flexible substrate, chip embedding process, etc. (Figure 2), while a common architecture that packages the entire system of built-in electronic devices and peripheral devices required for smart contact lenses is provided.
Companies, universities, and other research institutions that use this platform will be able to enjoy its function for a wide range of purposes and are expected to implement innovative services and products using smart contact lenses in our society for numerous fields such as Communication, Entertainment, and Education. (See Figure 3 and 4)
By using our analog circuit technologies, we provided a suitable ASSP chipset for the platform. This ASSP chipset is made of the MB97R7100 RF chip and the MS97R5430 16-bit AD converter chip (Figure5). It has scalability that allows functionalities to be added by attaching new chips and, by combining them with various sensors, they can collect and process different data as an edge device. Accordingly, its use is expected to be expanded to other products and fields.
Main Specifications
RF Chip MB97R7100
- EPC global Class1 Generation2 compliant
- Carrier frequency: 860-960MHz
- RF received power LSI terminal max power: up to 3.0V 600uA（for a +8dBm power transmission）
- 1.8V(or 2.2V) and 3V supply lines, 4 GPIOs
- Master/Slave Serial Peripheral Interface
- Embedded with FeRAM
MS97R5430 16 bit AD converter chip
- 16bit ΔΣ
- Sampling Frequency: 490sps
- Embedded with FeRAM
Related links
- RAMXEED home page
- FeRAM embedded ASSIC/ASSP Presentation
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SEED INTRODUCES ADVANCED MULTIPURPOSE PLATFORM FOR SMART CONTACT LENSES
（redirection to SEED’s website）
About RAMXEED
RAMXEED (former Fujitsu Semiconductor Memory Solution), specializes in innovative memory solutions, including FeRAM and ReRAM technologies. With over 25 years of accumulated sales of 4.6 billion FeRAM units and a focus on high-performance, energy-efficient non-volatile memory products, we aim to continue driving memory innovation for a variety of industries and applications.